Recently vivo released a new flagship Xplay5 series phones, Xplay5 using dual curved screen + Integrated metal body design, the appearance is quite amazing, and the use of new HiFi 3.0 vivo system, taking into account past vivo outstanding performance in terms of audio we have no doubt Xplay5 sound quality with high expectations, now following me tear-down this device and look at the mystery of vivo xplay 5 smartphone,
PS:vivo Xplay5 structure is more complex, many parts after dismantling difficult to restore, ordinary users do not try.
Don't forgot to pull out the SIM slot when you start dismantling before.
Xplay5 has vivo consistent design style, the bottom of the USB interface with two Torx screws, we start from here dismantling
Because Xplay5 adopted dual curved glass + one all-metal body design, so we can only be removed from the screen.
Using a suction cup will suck up the screen, first double-curved glass adhesive gasket and white together, and through the buckle and the metal back cover, the dismantling process to be careful to prevent the buckle fracture.
The screen and the back cover can be seen after the decomposition of the internal structure. The back cover of the usual metal vivo one cover, injection NFC antenna inside the rear cover and not before, Xplay5 likely to be emasculated NFC function.
Circuit design was relatively ready motherboard + battery + sub version of the design
After pressing the fingerprint identification mounted on the lid, through a contact to the motherboard, the relative difficulty of the back cover to simplify disassembly.
The battery by double-sided adhesive attached to the box, and will need to be heated + paddles disassemble it down.
Disconnect the phone's battery cable. All the cables are used in vivo metal bezel + screw to prevent cable due to shaking and rattling.
Battery Lithium ion polymer battery capacity of 3600mAh.
All cables include a camera uses a metal baffle is fixed, we will remove one by one
In order to facilitate the separation board, we will be deputy speaker baffle plates and removed all metal, then the screen will include a variety of cable, including cable, coaxial cable after the separation, and then further dismantling.
Speaker, USB interface, and a vibration motor in the sub plates.
Then you can get down to the motherboard, the motherboard is covered with a metal shield, basically there is no bare chip.
Back of the motherboard also covered with a metal shield, and a piece of copper foil overlying the shield to enhance the cooling of each chip.
After you remove the motherboard we can disassemble the camera down. Xplay rear camera 5 to 16 million pixels, the Sony IMX298 sensor, lens aperture f2.0, and no optical image stabilization. Pre-eight million, so the two are close in size.
We will be back of the board after the copper foil tear, you can see a large area of the metal below the shield, which applied thermal location SoC + flash chip. So much metal shield HiFi system should be designed in order to reduce mutual interference between the chips.
Xplay5 shield all use soldered on the motherboard, we will use a heat gun to remove each of its heating.
Remove most of the shield can be seen in a variety of specific models of the chip.
The most prominent of the back of the motherboard Samsung 0BMFGCF-K30F4F4 of LPDDR3L memory chips with a capacity of 4GB, the following package with Qualcomm Xiaolong 652,4 gold Cortex-A72 and four Cortex-A53 composed using 28nm HPM process, with Adreno 510 graphics processor.
Also a relatively large size is THGBMHG9C8LBAIG flash chips from Toshiba, using 15nm process, in line with eMMC 5.1 specification, capacity of 128GB.
Then finally to the audio chip from Cirrus Logic of this CS4398CN DAC chip. CS4398CN is Cirrus Logic's top decoder chip, the delicate disc support 24 bit / 192kHz decoding, signal to noise ratio is 120dB, distortion -107dB, is a classic DAC chip, vivo for the adjustment of the chip quite experience.
CS4398CN next from Texas Instruments 51AP8LI ADC3001 audio converter chip.
Next to the DAC chip, we also found a model for the "539Y5P" chips, suspected to vivo propaganda AD45257 op-amp chip.
From Qualcomm PM8004 power management chip.
Qualcomm chip PMI8952 PMIC (power management IC).
Qualcomm chip PMI8952 PMIC (power management IC).
Qualcomm WTR 2965 RF chip.
Skyworks 77824-11 RF radio frequency amplifier. (FDD LTE)
Skyworks 77629-21 RF power amplifier. (GSM EDGE WCDMA HSDPA)
From this point of view dismantling, vivo continues the consistent excellent work, the motherboard design is very neat, almost all chips are covered by the shield, and the heat in relatively large processor + memory chip components using thermal grease copper + foil auxiliary cooling mode, the cable also has a special place metal bezel, the materials can be described as relatively conscience. Machine with metal back cover curved screen + Integrated design, compact structure is rigorous. As the first all-metal double-curved screen + one body of the domestic mobile phone,
vivo Xplay5 not only has a beautiful appearance, there is a fairly reliable interior design, indeed regarded internally and externally.
